Samsung to Begin Shipping HBM4 Memory Chips to Nvidia in February
Samsung Electronics is preparing to start delivering its latest HBM4 high-bandwidth memory chips to Nvidia as early as February, according to South Korean industry reports. This move would place Samsung ahead of several competitors in supplying the newest generation of AI-focused memory.
Local business outlet The Korea Economic Daily reported that Samsung’s sixth-generation HBM4 products have successfully completed performance and compatibility evaluations with both Nvidia and AMD, clearing the way for commercial shipments next month. The development signals Samsung’s accelerated push into the advanced memory segment used for artificial intelligence hardware.
The company has been working to narrow the gap with SK Hynix, which currently leads the high-performance memory market. Media reports indicate Samsung also intends to begin mass production of HBM4 chips starting in February.
HBM4 technology is considered essential for next-generation AI accelerators, delivering higher data transfer speeds and improved power efficiency compared with previous memory generations.
Samsung’s shares in Seoul were little changed during trading, after earlier climbing nearly 3% to around 156,400 won, approaching their all-time high near 157,000 won.
Next-generation HBM4 high-bandwidth memory chips.
Nvidia.
February
SK Hynix.
They provide higher bandwidth and better efficiency for AI accelerators.
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